Advanced Electron Microscopy in Materials Research
The research unit advanced electron microcopy in materials research focuses on structural, compositional and functional characterization providing a direct correlation between synthesis/processing and properties/functionality in materials research.
KIT
High-end structural and compositional characterization is one of the essential requirements for advanced materials development; the experimental basis for a systematic understanding of materials and modelling. Electron microscopy is one of the most versatile and powerful tools to provide this basis by quantitative characterization of the atomic, nanometer and micron scale structure and composition. Moreover, in-situ experiments provide a direct correlation between structural changes, materials properties and functional behavior.
In addition to using state-of-the-art electron microscopy techniques for materials characterization, we develop microscopy techniques to provide answers to specific research problems in materials and physical sciences.
News & Publications
Successful Workshop on Advanced Electron Microscopy in Materials Research
The Workshop on Advanced Electron Microscopy in Materials Research was successfully held with 29 participants, including 20 internal and 9 external guests, highlighting strong engagement and interest in advanced microscopy techniques.
The Iliad Ultra (S)TEM has been installed at Campus South. Combining a future-proof concept with state-of-the-art design to advance research at the frontiers of materials science and nanotechnology.
Our warm congratulations to Dr. Kübel and his collaborators for the successful organization of the Microscopy Conference 2025. It was an inspiring and fruitful event that highlighted exciting advances in microscopy.
We look forward to seeing everyone at the next MC in Dresden in 2027!
We are applying advanced electron microscopy techniques such as (S)TEM, EELS, EDX, NBED, tomography and FIB to characterize a variety of materials for different application areas.