Configuration

• Operation Voltage:

  • High Tension SEM: 200 V - 30 kV

  • High Tension FIB: 0.2 kV - 30 kV      

• Source

  • FEG (Schottky)

  • Gallium Liquid Metal Ion Source

• Imageing Detectors:

  • In-lens SE, SESI,  EsB, 4QBSD

  • STEM detector

• Spectroscopy

  • EDAX EDX detector

• Diffraction

  • EDAX EBSD detector

• Gas Injection System (GIS)

  • C, Pt, and Si

  • XeF₂ for selective etch enhancing

  • Gas injection for charge compensation

• Manipulators

  • Omniprobe 400 with independent x,y, z motion and rotation

• Transfer System

  • High-vacuum transfer system compatible with glove box and UHV deposition system

Resolution

Imaging, Analysis and Sample Preparation Techniques      

• SE & BSE SEM analysis

• STEM imaging

• EDX analysis

• EBSD analysis

• 3D Slice & View tomography

• TEM sample preparation

• Nanoscale deposition and contacting