Research Topics
High-Entropy Materials and High Throughput Synthesis/Characterization:High-entropy materials offer versatile properties due to their individual elemental compositions and lattice geometry enabling the design of unique electronic and electrochemical properties. We employ robotic wet chemistry, spin coating, miniaturized droplet cells for impedance spectroscopy, UV/Vis, fast XRD by gallium jet technology and automized electrical probe stations. These methods enable rapid screening of vast compositional spaces and providing valuable insights into structure-property relationships. |
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Solution processible materials and thin films:Nanomaterials and complex multicomponent materials exhibit unique properties that are highly desirable for flexible and printed electronics. We investigate the materials from a powder level to their formulation into functional inks and up to the characterization of their film properties such as semiconducting, piezoelectric and mixed ionic-electronic transport properties. |
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Additive manufacturing with printing technologies:We use various methods and printing technologies in 2D and 3D such as inkjet printing, superinkjet printing, electrohydrodynamic printing, capillary printing and other scanning probe lithography techniques as well as laser printing. To be able to print fully functional electronic devices we explore the limits of printing resolution and work on novel ink recipes, substrate/ink interaction and combinations with other thin film techniques. |
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Printed electronic devices and circuits:We explore novel device concepts and architectures such as electrolyte gated thin film transistors, analog and digital memristors, ferroelectric gated devices, as well as novel circuit topologies such as neuromorphic circuits and hardware security primitives (e.g. physical unclonable functions). |
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3D Electronics:Advances in 3D printing of micro- and nanostructures allow for exciting novel approaches in electronics. We push methods such as laser, superinkjet, and capillary printing to investigate and develop new 3D, interconnection and integration concepts, involving several printed layers up to full devices in electronic, quantum and biomedical systems. Examples of this kind include superconductive 3D wires, photoconvertible metals, responsive 3D structures, piezoelectric and magnetic materials. |
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Bioelectronics and sensors:Printing technologies and printable materials offer a great potential for manufacturing bio-hybrid sensors and systems combining conventional electronic and biological materials. We work on bio-functionalized electrodes for improved cell compatibility, electrodes with biomimetic membranes for disease diagnosis, bio-functionalized extended-gate-electrodes or channels in printed field effect transistors and interfaces of electronics with biological components such as cells and organoids. |
Completed Projects
The sensIC project, "Unique identifiability for trustworthy hybrid sensor electronics using additive manufacturing," focuses on researching and developing a platform technology for trustworthy hybrid electronics to securely integrate printed electronics and silicon components directly into products using novel manufacturing methods and processes. | |
EnABLES integrates key European research infrastructures in powering the Internet of Things (IoT). Six research institutes together with five knowledge hubs of excellence will address the long term needs of energy management in self-powered smart sensor systems as required by IoT innovation. | |
ENSEMBLE³ Centre of Excellence located in Warsaw, Poland builds on the pioneering work of Prof. Czochralski and following world-leading expertise. Concept of the Centre has been created jointly by the following renowned institutions from Poland, Germany, Italy, and Spain: the Łukasiewicz Research Network Institute of Electronic Materials Technology and the University of Warsaw (Poland), the Karlsruhe Institute of Technology (Germany), the Sapienza University of Rome (Italy), and the Nanoscience Research Center nanoGUNE(Spain). | |
List is still under construction. More projects will follow soon.... |